KLA-Tencor Announces Voyager™ 1015 and Surfscan® SP7 Defect Inspection Systems: Addressing Two Key Challenges in Process and Tool Monitoring
"With leading IC technologies, wafer and chip manufacturers have very little room for error," said
The Surfscan SP7 unpatterned wafer defect inspection system achieves its game-changing sensitivity through substantial innovations in illumination and sensor architecture that produce decades of improvement in resolution over that of the previous-generation, market-leading Surfscan tool. This unprecedented leap in resolution is the key to detection of the smallest killer defects. The new resolution realm also enables real-time classification of many defect types, such as particles, scratches, slip lines and stacking faults—without removing the wafer from the Surfscan tool or affecting the system throughput. At the same time, exquisite control over peak power density allows the Surfscan SP7 to inspect thin, delicate EUV photoresist materials.
The Voyager 1015 patterned wafer defect inspection system closes a long-standing industry gap in after-develop inspection (ADI), leveraging novel illumination, collection and sensor architecture. This revolutionary laser scattering inspection system drives sensitivity forward while reducing nuisance signals—and delivers results substantially sooner than the next-best alternatives. Like the new Surfscan SP7, the Voyager system features exceptional control of power density, allowing inline inspection of delicate photoresist materials after develop. High throughput capture of critical defects in the litho cell and other modules of the fab allows process issues to be identified and rectified rapidly.
The first Surfscan SP7 and Voyager 1015 systems have been operating at leading wafer, equipment and chip manufacturers worldwide, where they work together with
Forward Looking Statements:
Statements in this press release other than historical facts, such as statements regarding the expected performance of the Voyager 1015 and Surfscan SP7 systems and the economic effects of defect reduction for wafer, equipment, materials and chip manufacturing facilities, are forward-looking statements, and are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations, and involve a number of risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including delays in the adoption of new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unanticipated technological challenges or limitations that affect the implementation, performance or use of
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