News Releases

Date Title and Summary
Toggle Summary KLA-Tencor Introduces New High Numerical Aperture Reticle Inspection Tool for 0.18-Micron Production and Early 0.13-Micron Development
KLA-Tencor Introduces New High Numerical Aperture Reticle Inspection Tool for 0.18-Micron Production and Early 0.13-Micron Development San Jose, CA, JULY 12, 1999 - KLA-Tencor Corp. (Nasdaq: KLAC) today unveiled the 365UV-HR-its new high numerical aperture (NA) reticle pattern inspection tool for
Toggle Summary KLA-Tencor Introduces First In-Line Profiler Designed to Measure High Aspect Ratio Etched Structures at Sub-0.18-Micron Levels
HRP-240ETCH tool expands KLA-Tencor's CuPMC<font size=-1><sup>TM</sup></font> offering
Toggle Summary KLA-Tencor Helps IC Makers Break the Copper Yield Barrier with First Process Module Control Solution for Copper Interconnects
New CuPMC<font size=-1><sup>TM</sup></font> designed to speed copper development yield ramps to levels currently attainable only through traditional aluminum processes
Toggle Summary KLA-Tencor Launches Industry's First In-Line Scanning E-Beam Inspection Tool for Sub-0.18 Micron and Copper Devices
New high-speed eS20 system works in tandem with optical inspection tools to accelerate device shrinks and new technology transitions
Toggle Summary KLA-Tencor Names Ken Schroeder Chief Executive Officer
Executes Second Phase of Strategic Succession Plan
Toggle Summary KLA-Tencor Introduces First On-Line, High Resolution KLA-Tencor Introduces First On-Line, High Resolution Sizing Module for Improved Semiconductor Yield Prediction
KLA-Tencor Introduces First On-Line, High Resolution KLA-Tencor Introduces First On-Line, High Resolution Sizing Module for Improved Semiconductor Yield Prediction San Jose, CA, June 3, 1999 - KLA-Tencor Corp. (Nasdaq: KLAC) today introduced its new automatic defect classification (ADC) sizing
Toggle Summary KLA-Tencor Introduces Overlay Metrology System for 0.13-Micron Design Rules
5300 Tool Enables Lithography Engineers to Tighten Overlay Budgets and Increase Yields
Toggle Summary KLA-Tencor Introduces Advanced Reticle Contamination Inspection System for DUV Lithography
KLA-Tencor Introduces Advanced Reticle Contamination Inspection System for DUV Lithography San Jose, CA, April 16, 1999 - KLA-Tencor Corp. (Nasdaq:KLAC) today introduced the industry's first ultraviolet-based reticle contamination inspection system designed to detect contaminants unique to deep
Toggle Summary KLA-Tencor Reports Operating Results for Third Quarter
KLA-Tencor Reports Operating Results for Third Quarter San Jose, CA, April 14, 1999 - KLA-Tencor Corporation today announced operating results for its third quarter ended March 31, 1999. Revenues were $211 million compared to $274 million for the March quarter of 1998.
Toggle Summary KLA-Tencor's Advanced CD SEM Addresses New Metrology Challenges for Low k1 Photolithography
The 8100XP-R Enhances KLA-Tencor's Advanced Pattern Transfer Optimization Solution